SOT-223 - Infineon Technologies

Overview

CoolMOS™ superjunction MOSFETs in SOT-223 package

Cost-effective DPAK drop-in replacement for consumer applications

Infineon provides the first complete high voltage MOSFET portfolio in a SOT-223 package worldwide to reduce the overall bill of material (BOM) while maintainting full compatibility to a DPAK footprint. The SOT-223 package is available with the latest CoolMOS ™ superjunction technologies tailored for consumer applications:

600V CoolMOS™ PFD7: The CoolMOS™ PFD7 family is the benchmark combination of best-in-class performance and state-of-the-art ease of use. Thanks to an integrated ultrafast body diode, PFD7 in SOT-223 package is a reliable key enabler for cost-sensitive, and energy-efficient designs, such as required for inverters in home appliance drives. Besides that, it helps to push ultrahigh power density designs such as chargers and adapters to the next level.

600V, 700V, 800V and 950V CoolMOS™ P7: The CoolMOS™ P7 superjunction MOSFET tackles common barriers in the consumer SMPS market thanks to its excellent performance and ease-of-use. Housed in the SOT-223 package, it is the price-competitive fit to charger, adapter, TV, Major & Small Home appliance and Lighting SMPS.

500V, 600V, 650V, 750V CoolMOS™ CE: Infineon’s SOT-223 package was first introduced in 2016 with the CoolMOS™ CE series and is specifically targeting mobile charger applications and decreasing the power ratings of LED lighting applications.

Products

Details

Thermal behavior similar to DPAK

The thermal behavior of the SOT-223 depends on the layout of the board and on the power consumed. We have measured the thermals in a test environment and compared with a simulation.

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Thermal behavior similar to DPAK

~2°C–3°C temperature increase on DPAK footprint as DPAK
Same temperature on footprint of DPAK + 20mm additional copper area
10°C temperature increase on SOT-223 footprint

The thermal measurements in several applications were confirmed by simulation with T _ambient= 70°C and P _loss= 250mW. The simulations confirm that on a DPAK footprint a 2°C–3°C temperature increase versus DPAK is expected, while for the copper areas of 20mm additional copper the temperature is equal to the DPAK temperature.

SOT-223 package footprint

The SOT-223 package without the middle pin is fully compatible to the footprint of a DPAK and therefore allows a one-to-one drop-in replacement and second sourcing at lower cost.

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CoolMOS™ PFD7 and P7 in SOT-223

Combining excellent performance and ease-of-use with a cost-effective package solution

CoolMOS™ P7 is designed to address typical challenges in low power consumer SMPS applications, while 600V CoolMOS™ PFD7 gives a competitive edge to Home appliance drives applications. Both families offer excellent performance and ease-of-use, enabling improved form factors and price competitiveness.

This combination makes CoolMOS™ 7 SJ MOSFET in SOT-223 a perfect fit for the target applications – charger, adapter, TV and lighting SMPS as well as major & small home appliance drives.

Key features and benefits of CoolMOS™ PFD7 & P7 SJ MOSFET in SOT-223

Best-fit performance superjunction technologies

Enabling lower MOSFET chip temperature
Leading to higher efficiency compared to previous technologies
Allowing improved form factors and slim designs

Cost-effective package solution

Drop-in replacement for DPAK at competitive cost
Space savings in designs with low power dissipation; enabling smaller form factors
Comparable thermal behavior to DPAK

Best-in-class price/performance ratio

Attractive price position for high performance technologies

Learn more about the CoolMOS™ PFD7 family

Learn more about the CoolMOS™ P7 family

500V/600V/650V/700V CoolMOS™ CE in SOT-223

Infineon’s SOT-223 package was first introduced in 2016 with the CoolMOS™ CE, which is a product family of high voltage superjunction MOSFETs launched to specifically address the needs of consumer and lighting applications.

Key features and benefits