ToF 3D image sensors for consumer and industrial

Infineon’s REAL3™ image sensor family opens up a completely new world of exciting applications for devices deployed in consumer and industrialmarkets, while also setting new performance and security benchmarks for existing use cases.

The REAL3™ image sensors are based on Infineon ToF (Time-of-Flight), which is the most advanced vision sensing technology in the world today and is already powering the smallest depth-sensing 3D camera modules on the market.

Infineon’s REAL3™ 3D image sensor delivers depth data in real time with a capture speed in the order of milliseconds; it is contact-less, fast and robust to ambient lightning conditions. Thanks to its patented technology for suppression of background illumination (SBI), REAL3™ supports camera deployments under all ambient light conditions. REAL3™ time-of-flight image sensors allow electronic devices to build a 3-dimensional map of the scene in front of the electronic gadget – whether that be a room, a moving or static object or a person – and translate that map to the digital world in real time. Advanced algorithms use that data to measure distance and size and to track motion and movements.

In addition, the single-chip REAL3™ imager brings a third dimension to biometric identification, to 3D scanning and to hand gesture and body tracking. Outstanding performance in 3D computational photography and augmented reality applications revolutionize the user experience.

The REAL3™ product portfolio also comprises imagers for automotive applications and VCSEL driver ICs.

The consumer grade ToF imagers are only available as bare die and targeting high volume applications. If you are looking for a complete ToF camera module to directly use the 3D pointcloud in your application we have a partner network of modulemaker and camera designhouses established.

If you are interested to find the right partner or to learn more about the REAL3 product portfolio please contact our Support Center by providing us some basic information about your application requirements.

Infineon’s REAL3™ hybrid Time of Flight solution is a novel ToF paradigm that combines a single ToF image sensor with two types of illumination to:

• Support SLAM (Accurate room mapping and smart navigation)
• Avoid obstacles
• Detect cliffs

Infineon and partners have developed hToF as a cost-efficient depth sensing technology for consumer products. Particularly for consumer robotics, the smaller hToF sensors help designing slimmer robots compared to robots equipped with laser-distance-sensor (LDS) towers.

The unique hToF technology uses Infineon’s high-resolution REAL3™ ToF sensor along with a homogenous flood illumination and a powerful spot grid illumination offering a cost-efficient solution. The hToF camera’s broad, 110° horizontal field-ofview (FoV) is ideal for both SLAM and obstacle avoidance. hToF works in all lighting conditions from complete darkness up to bright sunlight and across a large variety of furniture and floor reflectivity and textures. This technology advancement provides a huge advantage over other technologies such as structured light that struggles in bright sunlight, and also stereo vision that has difficulties in darkness and with repetitive textures.

Details about the hToF technology, performance & benefits can be found in the dedicated hToF technology whitepaper.

Infineon REAL3^TM ToF based camera samples are available at our partner OMS.

Jan 30, 2024 | Business & Financial Press
Infineon presents hybrid Time of Flight (hToF): Advanced technology for next-generation smart robots

In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies AG has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots. Read more

Dec 1, 2022 | Market News:
i-ToF imager based on Infineon’s novel pixel technology
boosts 3D camera system performance at optimized cost

In cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new
i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices. Read more.

Oct 28, 2022 | Market News
Infineon’s REAL3™ ToF imager enables advanced obstacle avoidance
and smart navigation in DREAME’s new vacuum cleaning robot W10 Pro

Dreame, a leading Chinese based company specialized in smart home cleaning devices, has launched its new vacuum cleaning robot, the Dreame Bot W10 Pro. The smart vacuum cleaner is equipped with a camera featuring the REAL3™ Time of Flight (ToF) image sensor from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and pmdtechnologies. The ToF imager enables smart navigation, 3D mapping, and excellent obstacle avoidance for service robots, cleaning robots and mops. Read more.

May 30, 2022 | Press release: Infineon and pmdtechnologies develop 3D depth-sensing technology for Magic Leap 2 – enabling advanced cutting-edge industrial and medical applications.

Jun 23, 2021 | Press release : Infineon and pmdtechnologies partner with ArcSoft for under-display Time-of-Flight turnkey solution

Oct. 27th, 2020 | Press release 
State-of-the-art photography results and immersive AR experiences:
Infineon and pmd offer 3D-imager with longest range in the market

Gaming, virtual e-Commerce, 3D online education: Augmented Reality (AR) applications with three-dimensional depth sensors link the real with the digital world and are strongly demanded. Infineon Technologies AG and pmdtechnologies developed a 3D depth sensor based on the Time of Flight (ToF)-technology which outperforms other solutions in the market and aims for target applications that offer a wider spectrum of innovative consumer usability. The 3D sensor market in smartphones for rear side cameras is expected to grow up to more than 500 million units per year until 2024. Read more

Press release March 5, 2020: Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication

Press release Jan 06, 2020: Infineon presents the world´s smallest 3D image sensor for face authentification and photo effects on smartphones

Personal consumer electronics:

• Smartphones and tablets
• Head-mounted devices
• Wearables 

Service robots:

• Robot Vacuum Cleaner
• Social and entertainment robots
• Edutainment

Home security and monitoring systems:

• 3D-Face ID door opener and access control
• Area surveillance
• People counting

Factory automation:

• Collaborative robots
• Warehouse and delivery robots
• Facial authentication