Dual-phase 160 A power modules in 8x8x4 mm package

Artificial intelligence is driving an exponential increase in global data generation, and consequently increasing the energy demand of the chips that support this enormous data growth, now approaching a thermal design power of >1000 W. As AI servers require 3 times more energy than traditional servers, with data centers already consuming more than 2% of the global energy supply, it is essential to find innovative power solutions and architecture designs that can lead to a measurable impact on global energy savings, as well as better total cost of ownership for data centers.

In response to the rising power demands of AI GPU (Graphic Processor Unit) platforms, Infineon introduces the second generation of dual-phase power modules: OptiMOS™ TDM2354xD and TDM2354xT series, geared for vertical power delivery (VPD) and showcasing industry’s best current density, benchmark electrical and thermal efficiencies.

Why choose Infineon’s TDM2354x power modules:

• Industry leading power density: 8x8x4 mm for 160 A peak for non-TLVR option
• Industry first dual-phase TLVR power module option available in 8x8x5mm package with 160 A peak capability
• >1.5 A/mm² TDC (thermally managed)*
• Over 3x reduction in junction-to-board thermal impedance enabled by Infineon chip-embedded packaging vs previous generation
• Proprietary magnetics enable low-profile vertical power delivery in compact footprint 

And 3 to choose Infineon:

• Proven market leader in computing
• Cutting-edge technologies
• Strong & diversified manufacturing footprint

*Coldplate temperatures 80°C and below