EVAL_3K3W_BIDI_PSFB

This evaluation board introduces a highly efficient complete Infineon system solution for a 3300W bi-directional DC-DC converter targeting telecom, battery formation power and industrial robotics applications. 

Infineon’s 600V CoolMOS™ CFD7 superjunction MOSFET in ThinPAK package is the most recent and best performance fast body diode device. Combined with a low parasitic package and an optimized layout, it achieves great performance with minimum stress. The innovative cooling concept presented in this board enables its remarkable performance.

This board achieves 98% efficiency in buck mode and 97% in boost mode. The attained power density is in the range of 4.34W/cm³ (71.19W/in³), which is enabled by the use of SMD packages and the innovative stacked magnetic construction.

When combined with the latest technologies from Infineon, this DC-DC converter proves the feasibility and high efficiency of PSFB designs at the level of fully resonant topologies.

The EVAL_3K3W_BIDI_PSFB shows as well that the PSFB topology can be used as a bi-directional DC-DC stage without changes in the standard design or construction of a traditional and well known topology. This is achieved thanks to innovations in control techniques powered by digital control and XMC™ microcontrollers.

List of components

• 600V CoolMOS™ CFD7 superjunction MOSFET
  (IPL60R075CFD7)
• CoolSiC™ Schottky diode 650V G6
  (IDH08G65C6)
• 800V CoolMOS™ superjunction MOSFET
  (IPU80R4K5P7)
• 150V OptiMOS™ 5 power MOSFET in Super SO-8 package
  (BSC093N15NS5)
• EiceDRIVER™ 2EDS isolated gate driver IC
  (2EDS8265H)
• EiceDRIVER™ 2EDF isolated gate driver IC
  (2EDF7275F)
• XMC4200 microcontroller for control implementation
  (XMC4200-F64k256BA)
• Quasi-resonant flyback PWM controller
  (ICE5QSAG)
• Medium power AF Schottky diode
  (BAT165)
• DC-DC step-down voltage regulator
  (IFX91041EJV33)

• Energy storage systems
• Telecom
• Battery formation power
• Industrial robotics
• Industrial automation