FS1150R08A8P3LMC This HybridPACK™ Drive G2 module is a very compact six-pack power module with enhanced package optimized for hybrid and electric vehicles

综述

The power module implements Infineon’s next generation chip technology EDT3 (Si IGBT) 750V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

特征描述

  • VCES = 750 V
  • ICN = 1150 A / ICRM = 2300 A
  • Blocking voltage 750 V
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • 4.2 kV DC 1 second insulation
  • High creepage and clearance distances
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guidelines
  • PressFIT contact technology

优势

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design
  • Lower system BOM
  • Lower AC contact resistance
  • Lower tab temperature
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

潜在应用

  • Automotive applications
  • (Hybrid) electrical vehicles (H)EV
图表
支持