FS520R12A8P1LB This HybridPACK™ Drive G2 module is a very compact six-pack power module (1200V/520A) with enhanced package optimized for hybrid and electric vehicles.
综述
The power module implements Infineon’s next generation IGBT chip technology 1200V, optimized for electric drive train applications, from mid- to high-range automotive power classes.
特征描述
- VCES = 1200V, ICN = 520A
- Low VCE,sat & switching losses
- Low Qg and Crss
- Low inductive design
- Tvj,op = 175°C
- On-chip temperature sensor
- 4.2 kV DC insulation
- High creepage & clearance
- Compact & high power density
- Direct-cooled PinFin
- PressFIT contact technology
- RoHS compliant & UL 94 V0
优势
- Higher temperature cycling capability
- Integrated diode temperature sensors
- New plastic material
- Better temperature capability
- New frame design for lower system BOM
- Lower AC contact resistance and tab temp
- PressFIT Contact Technology
- RoHS compliant
- Completely Pb free
- Superior reliability
潜在应用
- Automotive applications
- (Hybrid) electrical vehicles (H)EV
支持
