FF2600UXTR33T2M1

综述

XHP™ 2 CoolSiC™ MOSFET halfbridge module 3.3 kV, 2.5 mΩ with .XT interconnection technology for decarbonizing transportation.

特征描述

  • CoolSiC™ MOSFET 3.3 kV
  • Integrated body diode
  • XHP™ 2 housing
  • .XT interconnection technology

优势

  • Energy efficiency
  • High power density
  • Enhanced lifetime
图表
视频
Share
培训
Share
支持