FS03MR12A6MA1B

综述

This HybridPACK™ Drive is a very compact six-pack module (1200V/400A) optimized for hybrid and electric vehicles.

The power module implements the new CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications. The CoolSiC™ MOSFET was optimized for applications with switching frequencies in the range of 10 - 30 kHz.

特征描述

Electrical Features

  • New semiconductor material - Silicon Carbide
  • Blocking voltage 1200V
  • Low RDSon
  • Low Switching Losses
  • Low Og and Crss
  • Low Inductive Design <10nH
  • T vj op= 150°C

Mechanical Features

  • 2kV DC 1sec Insulation
  • High Creepage and Clearance Distances
  • Compact design
  • High Power Density
  • Direct Cooled PinFin Base Plate
  • High Performance Si3N4 Ceramic
  • Guiding elements for PCB and cooler assembly
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • UL 94 V0 module frame

优势

  • Compact Design
  • Direct Cooled Base Plate
  • Guiding elements for PCB and cooler assembly
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS complient
  • Superior reliability

潜在应用

  • Automotive Applications
  • Hybrid Electrical Vehides (H)EV
  • Motor Drives
  • Commercial Agriculture Vehicles
  • Main inverter

 

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Quality beyond the standard: Producing quality automotive power modules

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  • Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
  • Learn where and how this high-quality standard is reflected and discover our success stories

Infineon's 2nd generation HybridPACK™ Drive CoolSiC™

  •  Infineon's HybridPACK™ Drive silicon carbide compact power modules cater to the increasing demand for high range, efficiency, and power in electrified vehicles, enabling longer drive range, compact size, and optimized system cost.
  • The second generation of Infineon's HybridPACK™ Drive, utilizing CoolSiC™ technology, offers a scalable product family with enhanced features and package improvements, providing added value to customers.
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