EV INV HP1 SI 07 Enhance Automotive and eMobility Applications with Infineon's Evaluation Kit for HybridPACK™ 1 Main Inverter, Gate Driver, and Logic Board

Infineon's Evaluation Kit features the HybridPACK™ 1 power module, coreless transformer isolated driver (1ED020I12- FA), and logic board, making it ideal for (H)EV applications up to 20kW. With automotive qualified IGBT and Diode chip set, driver IC, and coreless transformer technology, it offers up to 1200 V and 2 A driving capability, Vce sat-detection, and compatibility with various motor position interfaces like encoder, resolver, and GMR for automotive applications, all powered by the TriCore™ family 32-bit microcontroller TC1767.