DF300R07W2H3_B77 650 V, 200 A 3-level IGBT module

Überblick

EasyPACK™ 2B 650 V, 300 A 3-level IGBT module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC.

Zusammenfassung der Merkmale

  • Easy of use
  • compact design
  • optimized performance
  • Increased blocking voltage capability up to 650 V
  • Low inductive design
  • Low switching losses
  • Low VCE,sat
  • Al2O3 substrate with low thermal resistance
  • Compact design
  • PressFIT contact technology
  • Rugged mounting due to integrated mounting clamp

Vorteile

  • Best cost-performance ratio with reduced system costs
  • High degree of freedom in design
  • Highest efficiency and power density
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