FF1200R12IE5P 1200 V, 1200 A dual IGBT module

Überblick

PrimePACK™ 2 1200 V, 1200 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT fast switching interconnection technology, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material.

Zusammenfassung der Merkmale

  • Extended operating temperature (Tvj op = 175°C)
  • Output current increased by more than 25% in the same footprint
  • Copper bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 400
  • Pre-applied Thermal Interface Material

Vorteile

  • Increase in power density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions

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