FS3L50R07W2H3_B11 650 V, 50 A 3-level IGBT module

Überblick

EasyPACK™ 2B 650 V 3-level NPC1 full-bridge IGBT module with NTC and PressFIT Contact Technology

Zusammenfassung der Merkmale

  • High Speed IGBT H3
  • Low Switching Losses
  • Fast Si clamping diodes 25 A 650 V
  • Al 2 O 3  Substrate with Low Thermal Resistance
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps

Vorteile

  • Compact design
  • Optimized customer’s development cycle time and cost
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