IPLK80R900P7

Überblick

800 V CoolMOS™ P7 superjunction MOSFET in ThinPAK 5x6 package

The 800V CoolMOS™ P7 superjunction MOSFET series is a perfect fit for low-power SMPS applications by fully addressing market needs in performance, ease-of-use and price/performance ratio. It mainly focuses on flyback applications including adapter and charger, audio SMPS, AUX and industrial power.

It offers up to 0.6% efficiency gain and 2°C to 8°C lower MOSFET temperature compared to its predecessor as well as to competitor parts tested in typical flyback applications. It also enables higher power density designs through lower switching losses and better DPAK R_DS(on) products. Overall, it helps customers save BOM cost and reduce assembly effort. The ThinPAK 5x6 package is characterized by a very small footprint of 5x6 mm² and a very low profile with a height of 1 mm. Together with its benchmark low parasitics, these features lead to significantly smaller form factors and help to boost power density. This combination makes CoolMOS™ P7 in ThinPAK 5x6 a perfect fit for its target applications.

Zusammenfassung der Merkmale

Best-in-class FOM R_DS(on) * E_oss; reduced Q_g, C_iss and C_oss
Best-in-class DPAK R_DS(on) of 280mΩ
Best-in-class V_(GS)th of 3V and smallest V_(GS)th variation of ± 0.5V
Integrated Zener diode ESD protection up to Class 2 (HBM)
Best-in-class quality and reliability
Low EMI
Wide range of R_DS(on)values
Fully optimized portfolio

Vorteile

0.1% to 0.6% efficiency gain and 2°C to 8°C lower MOSFET temperature as compared to CoolMOS™ C3
Enabling higher power density designs, BOM savings and lower assembly cost
Easy to drive and to design-in
Power density improvement compared to latest CoolMOS™ charger technology
Better production yield by reducing ESD related failures
Less production issues and reduced field returns
Easy to select right parts for fine tuning of designs

Potentielle Zielanwendungen