FF2000UXTR33T2M1
Überblick
XHP™ 2 CoolSiC™ MOSFET halfbridge module 3.3 kV, 1.9 mΩ with .XT interconnection technology for decarbonizing transportation.
Zusammenfassung der Merkmale
- CoolSiC™ MOSFET 3.3 kV
- Integrated body diode
- XHP™ 2 housing
- .XT interconnection technology
Vorteile
- Energy efficiency
- High power density
- Enhanced lifetime
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