FF2000UXTR33T2M1 CoolSiC™ MOSFET halfbridge module 3.3 kV

Überblick

XHP™ 2 CoolSiC™ MOSFET halfbridge module 3.3 kV, 1.9 mΩ with .XT interconnection technology for decarbonizing transportation.

Zusammenfassung der Merkmale

• CoolSiC™ MOSFET 3.3 kV
• Integrated body diode
• XHP™ 2 housing
• .XT interconnection technology

Vorteile

• Energy efficiency
• High power density
• Enhanced lifetime

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