FF2600UXTR33T2M1

Überblick

XHP™ 2 CoolSiC™ MOSFET halfbridge module 3.3 kV, 2.5 mΩ with .XT interconnection technology for decarbonizing transportation.

Zusammenfassung der Merkmale

• CoolSiC™ MOSFET 3.3 kV
• Integrated body diode
• XHP™ 2 housing
• .XT interconnection technology

Vorteile

• Energy efficiency
• High power density
• Enhanced lifetime

Diagramme

Parameter

Dokumente

Bestellung

Design Support

Videos

Share

Partners

Trainings

Share

Packaging

Kontakt