FF3MR20KM1HP
Überblick
62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing combined with M1H chip technology and pre-applied Thermal Interface Material (TIM).
Zusammenfassung der Merkmale
- High current density
- Low switching losses
- Superior gate oxide reliability
- Robust integrated body diode
- High cosmic ray robustness
- High speed switching module
- Symmetrical module design
- Standard construction technique
Vorteile
- Minimizes cooling efforts
- Reduction in volume and size
- Reduced system costs
- Improved chip performance
Diagramme
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