IM69D127 | High performance XENSIV™ MEMS microphone in a small 3.6 x 2.5mm package

Overview

IM69D127 is a digital high performance MEMS microphone based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60 x 2.50 x 1.00 mm3 makes it a perfect match for compact audio devices, such as TWS earbuds.

Summary of Features

Very-low self-noise / very-high SNR (69dB)
Selectable power modes for battery critical applications
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
Small package size (3.6x2.5x1.0mm)
Very tight part-to-part phase and sensitivity matching (± 1dB)
Flat frequency response with a low LFRO (low frequency roll-off) of 40Hz
Very-low group delay (9µs)

Benefits

Crystal clear audio pick up of the quietest and the loudest sounds
Small package size and high ingress protection (IP57) at a microphone level
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Potential Applications