CYW55571 - Infineon Technologies

Überblick

Wi-Fi 6E tri-band Wi-Fi and Bluetooth® 5.3 SoC

The highly-integrated, robust AIROC™ CYW55571 is part of the Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The powerful solution supports Wi-Fi 6/6E features and is tri-band capable (2.4G, 5G, 6G) and is available in single stream of data. It offers exceptional high-quality video/audio streaming and seamless connectivity experiences in congested network environments and significantly reduces latency by operating in the 6G spectrum, while also decreasing the total bill of materials cost and board space.

Zusammenfassung der Merkmale

Wi-Fi 6/6E Tri-band 1x1, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM
20/40/80 MHz channels, 1024-QAM, up to 600 Mbps PHY data rate
STA and Soft AP mode
Network offload features conserve power in chip and system level
Multi-Layer security for protection of individual subsystems through whole product life-cycle
Smart coexistence between Wi-Fi and Bluetooth®, or to external LTE, 15.4 radio

Bluetooth® Features

Bluetooth® 5.3 certified, Dual-mode operation
LE audio with Auracast broadcast (trademark) ,LE- 2Mbps, Long Range, Advertising Extensions
Bluetooth transmitting option of 20dbm,13dbm or 0 dbm

General Features

Interfaces: WLAN: PCIe, SDIO, Bluetooth®: UART, I2S, PCM
Temperature: -40°C to 85°C

Package

FCBGA 0.65 mm pitch
WLCSP: 0.2mm pitch
WLBGA: 0.35mm pitch

Vorteile

High-performance beyond Wi-Fi 6/6e requirements
Optimizes power in chip level and system level
Maximizes network efficiency
Extends edge AI and IoT device capabilities with robust connections and extended range
Bluetooth® LE audio delivers high-quality audio
Multi-layer security & network intelligence for greater protection
Accelerates time to market
Reduces development costs

Potentielle Zielanwendungen