Infineon and Hosiden Cooperate on Silicon Microphone Activities

Neubiberg, Germany and Osaka, Japan – October 2nd, 2007 – Infineon Technologies AG (FSE, NYSE: IFX) and Hosiden Corporation (TSE, OSE: Hosiden), one of the world’s leading microphone manufacturers, today announced a cooperation on Silicon Microphones activities. Infineon contributes its semiconductor expertise and MEMS (Micro Electro-Mechanical Systems) knowledge to develop and produce silicon microphones that are significantly smaller and more rugged than current microphones. Hosiden adds its vast competence in supporting Infineon with electro-mechanics and acoustics, application knowledge for successful integration into devices as well as with Hosiden’s market expertise.

“Our vision and goal is to form a strong alliance with Hosiden,” said Peter Schiefer, Vice President and General Manager of the Discrete Semiconductors business unit for the Automotive, Industrial and Multimarket business group at Infineon Technologies. “We combine the strengths of two technologically leading companies to jointly develop a family of silicon microphones. These will have smaller package sizes than today’s solutions, enable high-end acoustics for better sound quality and provide digital interfaces for reduced interference.”

The Infineon silicon microphone is more rugged and more immune to RF and shocks compared to classical microphones. It also exhibits higher heat resistance withstanding temperatures of up to 260 C. Due to the high temperature-resistance, it can be soldered without any loss in sensitivity onto a standard PCB and is ideally suited for use on fully automated production lines. Hosiden’s acoustic products include microphones, headset and Bluetooth headset.

A Hosiden spokesman said, ”By combining Hosiden’s acoustic strengths with Infineon’s silicon MEMS and ASIC expertise, we can ensure, that our customers get application-optimized, high quality products earlier in their design cycle, combined with a very high level of customer support from both companies. Our customers ask for the best microphone portfolio, keeping good properties of acoustic, challenging to miniaturize and matching auto-assembly production. With the Infineon partnership, we can close our portfolio gap and offer the best solution for the customer, independent of the various technologies.”

For further technical information on the silicon microphone of Infineon, please visit: www.infineon.com/microphone  

For more information on the microphone portfolio of Hosiden, please visit: www.hosiden.com/web/frame/products_f.htm  

About Hosiden
Hosiden Corporation, Osaka, Japan, is the general electrical components manufacture, offering acoustic components (such as microphone, speaker/receive, headphone, headset), connecting components (such as connector, switch), LCD and components applied products (such as Bluetooth applied products) for solutions to IT & communication, AV and Automobile devices mainly, and clearing the digital period with new technologies. In fiscal year 2006 (ending March ’07), the company achieved sales of JPY312.7 billion. Hosiden operates globally with 18 manufacturing locations in 5 countries and 22 sales locations in 10 countries, with approximately 12,000 employees worldwide. Further information is available at www.hosiden.com.

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications and security. In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.