Infineon Power Module Runs Chang An Jiexun Hybrid Electrical Vehicles to be Used at Beijing Olympic Games

Neubiberg, Germany and Beijing, China – July 21, 2008 – Infineon Technologies AG (FSE/NYSE: IFX) today announced that one of its automotive power modules is being used to power energy-saving and environmentally-friendly cars that will be used at the Beijing Olympic Games. Infineon’s HybridPACK™1 module will operate in a total of 20 “Jiexun” hybrid electric vehicles (HEVs) of the Chinese car manufacturer Chang An, one of the leading Chinese car manufacturers.

The development of electrical cars is a great high-tech research result of China’s National 863 Program which is a high-tech research and development initiated in 1986, aiming to enhance technologies in key areas such as energy, biotech, space flight and so on. It is conducted by the government and encourages related enterprises to get involved.

At the Olympic Games, the Chang An HEVs are applied as taxi for both athletes and public. They are mild hybrid cars with an integrated starter generator that generates energy when braking (“ regenerative braking”) and provides additional power for driveaway or overtaking.

By using HybridPACK1 power module applied, Chang An Jiexun HEV cars can speed up to 160 km/h while reducing 20 percent of petrol consumption compared to those with combustion engine.

With the HybridPACK1 power module, Infineon succeeded to improve HEV electronic control systems in many ways. Infineon reduced the size of HEV electronic control systems by one third to only 20 cm x 30 cm as well as their weight to approximately 15 kilos. By using up to 30 percent less semiconductor area to achieve the required power rating, Infineon reduces the cost and complexity of HEV inverter system designs and at the same time improves their energy efficiency by up to 20 percent compared to existing systems. That means that in comparison to today’s solutions, Infineon HybridPACK1 reduces electrical power losses by one fifth enabling simpler cooling systems. The saved energy can be used for driveaway and takeover.

“Infineon combines know-how of the world leader in advanced power electronics and is the world’s second largest automotive semiconductor company to deliver innovative electronic solutions for our Jiexun HEV cars. These solutions have helped us to continue our long-term commitment to the entire China automotive market by being able to develop light vehicles of exceptional quality and reliability that the world’s leading light vehicle manufacturers have come to expect,” said Ren Yong, Majordomo of Hybrid Project of Chana Auto Co. Ltd, or simply called Chang An.

“It’s our great honor to be able to make a small contribution to the Beijing Olympic Games by co-operating with the Chang An Group to develop these environment-friendly HEV cars for use by the Games,” said Vivek Mahajan, Director of Consumer & Industrial Power at Infineon Technologies Asia Pacific. “As natural resources are getting scarcer by the minute as more cars go on the road in a highly mobile society, electronic components are a key to improve energy efficiency and reduce fuel consumption and emission of cars. We are proud to serve our customers to help save energy and protect the environment with technologically leading chips that make vehicles sense, think and act.”

HybridPACK power module: Technical details

Based on more than 20 years experience in the development of IGBT power modules and intense research efforts of new materials combinations and assembly technologies, as well as the usage of leading edge IGBT Trenchstop™ Fieldstop technology and thin wafer technology, Infineon has developed the HybridPACK1 power module dedicated to HEVs. It is part of Infineon’s HybridPACK family of automotive power modules which feature a cost-efficient system approach to provide high efficiency, high reliability, yet minimizing power losses.

Infineon HybridPACK1 is a power module designed for mild HEV applications with a maximum voltage supply up to 450 V and a power range up to 20 kW. It is based on Infineon’s leading IGBT Trenchstop Fieldstop technology, which offers lowest conduction and switching losses.

Designed for a permanent junction operation temperature at 150 °C, the HybridPACK1 accommodates a six pack chip configuration rated up to 400 A/600 V.

HybridPACK1 is suitable for air or low temperature liquid cooled inverter systems. The flat copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal cycling and power cycling reliability for mild hybrid inverter applications. For compact inverter design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.

Key features of power module HybridPACK1

• Complete IGBT six pack with NTC in one module
• 600V Trenchstop Fieldstop IGBT
• Matching emitter-controlled diodes
• Extended temperature range
• Enhanced wire bonding
• Current rating up to 400 A
• Thermal cycling rugged Al ₂O ₃ ceramic
• Flat copper base plate

Further information on car manufacturer Chang An at www.globalchana.com  
For further information on Infineon’s HEV solutions, please see www.infineon.com/hybrid

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).