Infineon Technologies and Mitsubishi Electric Team Up to Serve the Global Power Electronics Industry

Neubiberg, Germany – May 3, 2010 – Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.

Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A up to 150A, voltage class: 600V and 1200V) in the Smart-1,-2 and -3 housings of Infineon. As the creator of the new SmartPACK/PIM module concept, Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.

Users of SmartPACK/-PIM will now benefit from the new cooperation of two worldwide leading IGBT module manufactures.

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com