The first billion in sight: celebrating the success of Infineon’s 28 nm security ICs and smart card solutions at TRUSTECH 2024

Munich, Germany – 3 December 2024 – Higher efficiency and lower environmental footprint resulting in more powerful, sustainable applications: products manufactured in the 28 nanometer technology by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are setting the tone in the security semiconductor industry since their introduction at TRUSTECH 2022. By spring 2025, the 28 nm technology is expected to be integrated into 1 billion devices making it one of the fastest ramp-ups of Infineon for technologies in the security industry. This success is based on the key features of Infineon’s 28 nm technology which allow for accelerated design-in and time-to-market while supporting longer product lifecycles. With more than 100 customers already relying on this technology, the solutions are a proven choice for many industries.

For several years, Infineon's 28 nm technology has been in commercial production, with successful deployments in various fields, including automotive applications. For two years now, the technology is also widely used in smart card markets such as payment, ID, and transportation ticketing, as well as embedded security Integrated Circuit (IC) applications. The comprehensive portfolio of products ranges from TEGRION™ security ICs to turnkey solutions like SECORA™ Pay, SECORA™ Pay Green, eID-OS, and OPTIGA™. The 28 nm technology allows for refining Infineon’s existing and well-recognized solutions, proofing its long-lasting technological leadership in the smart card and security field.

Innovative security architecture and fast time-to-market

TEGRION™ security controllers and the turnkey solutions for Payment and ID comprise the innovative security architecture Integrity Guard 32, which marks the evolution of Infineon’s Integrity Guard that has been successfully in use in many applications for over 20 years. Integrity Guard 32 provides effortless, long-lasting security for fast time-to-market and time-to-certification, facilitating corresponding development adaptations and certifications on the customer side.

To meet individual customer requirements Infineon works closely with its partners: “Our AUSTRIACARD ACOS development team achieved exceptional speed in adapting and certifying our new product with Infineon's 28 nm technology, completing the process within just six months—nearly twice as fast as the competition. This achievement was boosted by Infineon's continuous and prompt support throughout the process”, said Paul Meinhardt, Director Payment Card Solutions, of Austria Card.

At this year’s TRUSTECH Trade fair show, the 28 nm technology will be showcased with solutions like the eID-OS security solution for electronic passports and the new SECORA™ Pay Green solution – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste.

Infineon at TRUSTECH 2024

Visit Infineon at this year’s TRUSTECH from 3 to 5 December at Paris Expo Porte de Versailles, booth G035 in Pavilion 5.2. This year, the Infineon booth will present a futuristic green park – a city center hub showcasing innovative payment and identity solutions and technologies, all of which can be implemented today. Visitors can dive into the future of payment and identity, where nature and digital technologies interconnect for green, secured, and convenient lifestyles. More information is available at www.infineon.com/trustech.

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 58,060 employees worldwide (end of September 2024) and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

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