| MIL-PRF-19500* covers screening requirements that all parts are submitted to as well as Quality Conformance inspection consisting of one or more of Group A, B, C, D and E for acceptance of the design of the process and of the production lot. MIL-PRF-19500 applies to discrete components such as MOSFETs and Schottkys. QPL discrete components have been qualified per MIL-PRF-19500. For more information on MIL-PRF-19500 screening and quality conformance inspection, consult the DoD document or contact factory. *Beryllia warning per MIL-PRF-19500 Packages TO-254, TO-257, TO-258, TO-259 contain beryllium oxide (beryllia). Devices containing BeO are marked with designation “BeO” as per MIL-PRF-19500. |
| |
| MIL-PRF-19500 Screening Requirements |
| Test/Inspection MIL Screen |
Test/Inspection |
JANS |
MIL-STD-750 Method |
| 1b |
Internal visual inspection (precap) |
100% |
2069 |
| |
Lot Accumulation |
|
|
| 3a |
Temperature cycling 20 cycles. No dwell time. Condition C, -55C to 150C |
100% |
1051 Condition C |
| 4 (1) |
Constant acceleration (Omitted if approved alternate flow option applied) |
100% |
2006 |
| 5 (1) |
PIND - Particle impact noise detection (Omitted if approved alternate flow option applied) |
100% |
2052 Condition A |
| 8 |
Case Marking and Serialization devices |
100% |
|
| 15 |
Radiography |
100% |
2076 |
| |
Thermal impedance / Delta VSD |
100% |
3161 |
| |
IL Test |
100% |
3470 |
| |
SOA |
100% |
|
| |
Initial Test / Gate Stress |
100% |
|
| 9 |
Pre Burn-in electrical parameters, R&R |
100% |
|
| 10 |
High temperature reverse bias (HTRB), 48 hours, MOSFET |
100% |
1042 Condition B |
| 11 |
Interim electrical, R&R and delta parameters for PDA |
100% |
|
| 12 |
High temperature reverse bias (HTRB), 240 hours, MOSFET |
100% |
1042 Condition A |
| 13 |
Final electrical test, R&R and delta parameters for PDA |
100% |
|
| |
Outlier identification |
100% |
Initial + Final |
| |
Hot and cold electrical test, R&R |
100% |
|
| |
Outlier identification |
100% |
Hot + Cold |
| 14 |
Hermetic seal (fine and gross leak) |
100% |
1071 |
| |
Bubble Test in FC, no pressurization |
100% |
|
| 17 |
Case isolation (Case Isolated Packages) |
100% |
1081 |
| |
Group A2 electrical test |
100% |
|
| 16 |
External visual exam |
100% |
2071 |
| |
Packaging |
|
|
Note (1): An IR HiRel approved and certified alternate flow may be applied instead of 100% screen |
| |
MIL-PRF-19500 Quality Conformance Inspection
MIL-PRF-19500 Group A Inspection Electrical Verification |
| Sub group |
Parameters |
MIL-STD-750 Method |
JANS Quantity (accept number) |
JANTX, JANTXV, Quantity (accept number) |
| 1 |
Visual and mechanical inspection |
2071 |
15 (0) |
45 (0) |
| 2 |
DC (static) test at +25˚C +/- 3C |
|
116 (0) |
116 (0) |
| 3 |
DC (static) tests at max. and min. temps at high (-0C, +10C) specified temperatures |
|
|
|
| 4 |
Dynamic tests at +25˚C +/- 3C |
|
|
|
| 5 |
"Safe operating area test (power trans.):
a. DC
b. Clamped inductive
c. Unclamped inductive
End point electrical measurements " |
|
45 (0) |
45 (0) |
| 6 |
"Surge current (diodes and recitifiers)
End point electrical measurements " |
|
|
22 (0) |
| 7 |
Selected static and dynamic tests |
|
|
|
|
| |
| MIL-PRF-19500 Group B Inspection Mechanical Verification (JANS) |
| Sub group |
Parameters |
MIL-STD-750 Method |
JANS large lot Quantity (accept number) |
JANS, Small Lot Quantity (accept number) |
| 1 |
Physical dimensions (case outline) |
2066 |
22 (0) |
8 (0) |
| 2 |
Solderability |
2026 |
15 leads (0) |
6 leads (0) |
| |
Resistance to solvents (ink mark only) |
1022 |
15 (0) |
6 (0) |
| |
Salt Atmosphere (laser marked metal) |
1041 |
3 (0) |
3 (0) |
| 3 |
Temperature cycling (100 cycles) |
1051 |
22 (0) |
"6 (0)
Use 12 (0) for Alt flow" |
| |
Surge (diodes only) |
4066 |
|
|
| |
Hermetic seal (fine and gross leak) |
1071 |
|
|
| |
"Constant acceleration 20kG or 10kG > 10W
(Applicable to alternative flow only) " |
2006 |
|
|
| |
"Particle impact noise detection, cond. A
(Applicable to alternate flow only)" |
2052 |
|
|
| |
Electrical measurements, A2 |
|
|
|
| |
Decap internal visual (qualified design) |
precap |
6 (0) |
6 (0) |
| |
Bond strength, condition D |
2037 |
22 wires (0) or 11 (0) |
12 wires (0) or 6 (0) |
| |
SEM (when applicable)* |
2077 |
6 (0) |
|
| |
Die shear |
2017 |
11 (0) |
6 (0) |
| 4 |
"Intermittent operating life (6k cycles if wire is
8 mils or greater in diameter, otherwise 2k)" |
1037 or 1042 |
22 (0) |
12 (0) |
| |
Hermetic seal (fine and gross leak) |
1071 |
|
|
| |
"Electrical measurements, A2
Thermal impedance (max. 15% shift) " |
|
|
|
| 5 |
Accelerated steady state HT GB, power MOSFET |
1042 |
22 (0) |
12 (0) |
| |
Cond. B, 48 hours @150C, 100% bias |
|
|
|
| |
Electrical measurements, A2 |
|
|
|
| |
Accelerated steady state HTRB, power MOSFET |
1042 |
|
|
| |
Cond. A, 240 hours @150C, 100% bias |
|
|
|
| |
Electrical measurements, A2 |
|
|
|
| |
Accelerated Steady State for Schottky |
1038 |
|
|
| |
340 hrs @ max rated Tj / 1K hrs per wafer lot |
|
|
|
| |
Electrical measurements, A2 |
|
|
|
| |
Bond strength |
2037 |
20 wires (0) |
20 wires (0) |
| 6 |
Thermal resistance (Diodes) |
3101, 4081 |
22 (0) |
8 (0) |
| 7 |
High temp life (340 hours non-operating) (Diodes) |
1032 |
32 (0) |
12 (0) |
| |
Electrical measurements, A2 |
|
|
|
*Note: Not applicable for Schottky's MIL-PRF-19500 Group B Inspection Mechanical Verification (JANTX, JANTXV)
| Sub group |
Parameters |
MIL-STD-750 Method |
JANTX, JANTXV Large Lot
Quantity
(accept number) |
JANTX, JANTXV Small Lot
Quantity
(accept number) |
| 1 |
Solderability |
2026 |
15 leads (0) |
4 leads (0) |
| Resistance to solvents (ink mark only) |
1022 |
15 (0) |
3 (0) |
| Salt Atmosphere (laser marked metal) |
1041 |
6 (0) |
6 (0) |
| 2 |
Temperature cycling(45 cycles, including screening) |
1051 |
22 (0) |
6 (0) |
| Thermal shock (10 cycles) |
1056 |
| Surge |
4066 |
| Hermetic seal (fine and gross leak) |
1071 |
| Electrical measurements, A2 |
|
| 3 |
Steady state operation life (340 hrs) or |
1042 |
45 (0) |
12 (0) |
| intermittent operating life (2k cycles) |
1042 |
| Hermetic seal (fine and gross leak) |
1071 |
| Electrical measurements, A2 |
|
| Bond strength, condition D |
2037 |
11 wires (0) |
11 wires (0) |
| 4 |
Decap internal visual (qualified design) |
precap |
1 (0) |
1 (0) |
| 5 |
Thermal resistance (Performed @ group C) |
|
15 (0) |
6 (0) |
| 6 |
High temperature life (340 hours) non-operating* |
1032 |
32 (0) |
12 (0) |
| Electrical measurements, A2 |
|
*Note: Not applicable for power MOSFETs |
| |
| MIL-PRF-19500 Group C Inspection Long-term Reliability Verification, Periodic, Each Package Type |
| Sub group |
Parameters |
MIL-STD-750 Method |
All Quality Levels |
All Quality Levels
Large Lot Quantity (accept number) |
| 1 |
Physical dimensions (Performed in B1 for JANS) |
2066 |
15 (0) |
6 (0) |
| 2 |
Thermal shock, 25 cycles, cond. B |
1056 |
22 (0) |
6 (0) |
| |
Terminal strength |
2036 |
|
|
| |
Hermetic seal (fine and gross leak) |
1071 |
|
|
| |
Moisture resistance |
1021 |
|
|
| |
Electrical measurements, A2 |
|
|
|
| 3 |
Shock, 1,500G, 0.5ms, 5 blows, X1, Y1 and Z1 |
2016 |
22 (0) |
"6 (0)
Use 12 (0) for Alt flow" |
| |
Vibration, variable frequency |
2056 |
|
|
| |
Constant acceleration, 1 minute in each orientation at 20,000 G's minimum, except at 10,000 G's minimum for devices with power rating of 10 watts. |
2006 |
|
|
| |
"Particle impact noise detection, cond A
(Approved alternative flow only)" |
2052 |
|
|
| |
Electrical measurements, A2 |
|
|
|
| 4 |
Salt atmosphere (corrosion) |
1041 |
15 (0) |
6 (0) |
| 5 |
Thermal resistance (if not performed in B) |
3101, 4081 |
15 (0) |
6 (0) |
| 6 |
Steady state operation life (1,000 hours min.) or |
1026 |
22 (0) |
12 (0) |
| |
intermittent operating life (6k cycles min.) |
1037 or 1042 |
|
|
| |
Electrical measurements, A2 |
|
|
|
| 7 |
Internal water vapor |
1018 |
5 (0) |
5 (0) |
|
| |
| MIL-PRF-19500 Group D Inspection Radiation Hardness Assurance Program |
| Sub group |
Parameters |
MIL-STD-750 Method |
JANTXV
Inspection Lot Quantity (accept number) |
JANS Wafer
Inspection Lot Quantity (accept number) |
| 2 |
"Steady-state total dose irradiation
Qualification and conformance inspection
End-point electrical parameters" |
1019 |
|
"4(0)
2(0)
1(0)" |
1. For device types ≥ 4,000 die per wafer
2. For device types > 500 and < 4,000 die per wafer
3. For device types ≤ 500 die per wafer |
| |
| MIL-PRF-19500 Group E Inspection Product Qualification |
| Sub group |
Parameters |
MIL-STD-750 Method |
All Quality Levels
Large Lot Quantity (accept number) |
| 1 |
Thermal shock (100 cycles) or |
1056 |
45 (0) |
| |
Temp. cycling (500 cycles min.) @ max. storage |
1051 |
|
| |
Hermetic seal (fine and gross leak) |
1071 |
|
| |
Electrical Measurements, A2 |
|
|
| 2 |
Steady state operation life, HTGB |
1042 |
45 (0) |
| |
Electrical measurements, A2 |
|
|
| |
Steady state operation life, HTRB |
1038, 1042 |
45 (0) |
| |
Electrical measurements, A2 |
|
|
| 4 |
Thermal resistance (characterization) |
3101, 4081 |
22 (0) |
| 5 |
Barometric pressure |
1001 |
3 (0) |
| |
(devices with rated voltage > 200V |
|
|
| 6 |
ESD |
1020 |
11 devices |
| 7 |
Resistance to Soldering Heat |
2031, H.6 |
|
| |
Visual inspection |
|
|
| |
Hermetic seal (fine and gross leak) |
1071 |
|
| |
Electrical measurements, A2 |
|
|
| 8 |
Single Event Effects (SEE) for ion specie and ion energy. Curve as a function of LET for fixed VGS and VDS bias conditions; |
1080 |
|
|
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