Automotive IGBT and CoolSiC™ MOSFET modules
Automotive power modules based on leading Si IGBT and CoolSiC™ technologies designed for hybrid electric and full electric vehicle (xEV) applications
Automotive IGBT and CoolSiC™ MOSFET modules subcategories
Automotive power modules based on Si IGBT and CoolSiC™ technologies
Automotive power modules are an essential component for high-voltage power conversion in hybrid and electric vehicles. Infineon offers the broadest portfolio of automotive power modules for a range of applications: Traction inverters (to convert the DC from the high-voltage battery to AC for the electric motors), onboard battery chargers, auxiliary inverters, HV/LV DC-DC converters, and specific fuel cell electric vehicle (FCEV) applications such as the fuel cell air compressors and DC-DC boost converters.
Our automotive power modules are based on Infineon‘s leading Si IGBT and CoolSiC™ technologies. The modules offer high-voltage performance, fast switching and low switching losses to maximize efficiency, as well as a high level of integration in compact modules. Infineon IGBTs and CoolSiC™ automotive power modules are AQG 324 qualified and offer high mechanical robustness and ease of use in design and manufacturing.
Improve system efficiency with cost-effective IGBT technology
Thanks to their high switching frequency and short-circuit rating, IGBT enable high efficiency and robust automotive designs and are the perfect match for plug-in hybrid vehicles and electric cars.
Infineon’s automotive IGBT modules portfolio includes the HybridPACK™ and EasyPACK™ product families which are equipped with our leading IGBT technologies, such as EDT2, that provide excellent efficiency and high reliability. Automotive IGBT modules cover power classes from 30 kW to 200 kW and are available in half-bridge, fourpack, and sixpack power semiconductor configurations. They provide ease of use in designing and manufacturing the inverters and are optimized for direct water cooling and include isolation.
Maximize efficiency with high-voltage performance and low losses
While Si IGBT remains the dominating technology in the automotive power module market, the strongly growing SiC MOSFET-based solutions complement our Si IGBT offering. Our CoolSiC™ MOSFET power modules offer a variety of benefits including lower losses and higher switching frequencies for higher efficiency, longer driving ranges, or overall lower system cost. They provide higher power density and extend our power modules to even higher power and lower overall system cost.
Superior performance in a range of voltage levels and current ratings
Our HybridPACK™ and EasyPACK™ lines offer five different package families (HybridPACK™ Drive G1 & G2, HybridPACK™ DSC, EasyPACK™ , HybridPACK™ 1 and HybridPACK™ DC6i, and HybridPACK™ 2), covering a wide range of voltage classes (650 V-1200 V) and power classes in Si and SiC technologies. Our broad portfolio of half-bridge and B6-bridge automotive power modules offers our customers the needed choice and flexibility to achieve design goals. Power device selection can be simplified and your design iterations can be accelerated by using Infineon‘s Online Power Simulation Platform (IPOSIM).
How can evaluation kits support your inverter design?
All of our evaluation kits are open designs and can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units. Passive three-phase inductive loads and simple load tests (DEMO-MODE) can be driven up to the maximum performance of the power modules. The shipping content includes a data source with schematics, layout and bill of material, information on the gate driver board, logic board, and interface PCB.
- Our evaluation kits are designed to support customers in their first steps in designing applications with our power modules. All of our evaluation kits are open designs. Therefore, they can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. In addition they can help to test the electrical and thermal performance of our power modules in an example application.
- Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units.
- Passive three phase inductive loads and simple load tests (DEMO-MODE) can be driven up to the maximum performance of the power modules. The shipping content includes a data source with schematics, layout and bill of material, information on the gate driver board, logic board and interface PCB. For instance,the Evaluation Kit HybridPACK™ Drive is intended to demonstrate the outstanding performance of the latest Infineon IGBT generation EDT2 combined with our latest module package HybridPACK™ Drive. One of many approaches of designing inverters with our flexible molded modules can be found in the Evaluation Kit HybridPACK™ DSC. It implements our HybridPACK™ DSC S1 or S2 and demonstrates the modules double-sided cooling concept resulting in high power density and advanced sensing & diagnostic concepts.
- Another supported application which can be demonstrated with our Evaluation Kit for EasyPACK™ is the HV/LV DC/DC Converter. The evaluation board – and our highly efficient EasyPACK™ itself – help to achieve less charging losses, increased battery voltage and charging speed.
| Where | Automotive IGBT & CoolSiC modules | www.infineon.com/cms/en/ tools/landing/iposim.html |
Online product page (partially myinfineon.com login) | Orderable online |
| Technical support online: www.infineon.com/cms/en/about-infineon/company/contacts/support | ||||
- Samples can be ordered online once productive samples are available
- For pre-productive samples, please contact your distributor or Infineon sales office for support. Pre-productive samples are not suitable for use in vehicles on the road or for qualification purposes!
- Black samples
–Use case: lab measurement
–IR camera can measure chip temperature under load conditions
–Lead time: 10 weeks ~ 6 months - Thermocouple modules
–Use case: lab measurement
–Temperature sensor can measure chip temperature under load conditions
–Lead time: 10 weeks (best case) ~ 6 months - Please contact your distributor or Infneon sales office for ordering special samples
-
Comment: HybridPACK™ Drive G2, HybridPACK™ DSC and HybridPACK™ DSC CoolSiC™ modules contain an on-chip temperature sensor which can deliver chip temperature data during lab evaluation special samples (black/thermocouple modules) are not required in this case
- Get to know Infineon’s IPOSIM tool, specifically for an automotive electric vehicle inverter
- Discover the steps involved in simulating different parameters and comparing the results of different Infineon products to see which is the best fit for your application
- Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
- Learn where and how this high-quality standard is reflected and discover our success stories
- Understand how Infineon’s power semiconductor module portfolio is a solution for the main challenges of the electric vehicle industry
- Know Infineon’s general value drivers as well as recent success stories on the electromobility market
