FS520R12A8P1LB This HybridPACK™ Drive G2 module is a very compact six-pack power module (1200V/520A) with enhanced package optimized for hybrid and electric vehicles.

Overview

The power module implements Infineon’s next generation IGBT chip technology 1200V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

Summary of Features

  • VCES = 1200V, ICN = 520A
  • Low VCE,sat & switching losses
  • Low Qg and Crss
  • Low inductive design
  • Tvj,op = 175°C
  • On-chip temperature sensor
  • 4.2 kV DC insulation
  • High creepage & clearance
  • Compact & high power density
  • Direct-cooled PinFin
  • PressFIT contact technology
  • RoHS compliant & UL 94 V0

Benefits

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design for lower system BOM
  • Lower AC contact resistance and tab temp
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

Potential Applications

  •  Automotive applications
  • (Hybrid) electrical vehicles (H)EV
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