FF1200XTR17T2P5P 1700 V, 1200 A dual IGBT module
Overview
XHP™ 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology, TRENCHSTOP™ IGBT5 and Thermal Interface Material for high reliability and robustness, combined with system availability and long lifetime for high power traction and wind applications.
Summary of Features
- Extended operation temperature (Tvjop= 175°C)
- Output current increased by more than 25% in the same footprint
- Copper bonds for high current carrying capabilities
- Sintering of chips for highest power cycling capabilities
- Total losses reduced by up to 20%
- Package with CTI > 600
Benefits
- Easier paralleling of modules
- Increase in Power Density by up to 25%
- Up to 10 times longer lifetime
- Less cooling effort for same output power
- Enables higher system overload conditions
Support
