Thin-PAK 8x8

Infineon's Thin-PAK 8x8, a leadless SMD package for high voltage MOSFETs, has a very small footprint of only 64 mm² (vs. 150 mm² for the D²PAK) and a very low profile with only 1 mm height (vs. 4.4 mm for the D²PAK). This significantly smaller package size in combination with its benchmark low parasitic inductances is highly effective to decrease system solution size in power-density driven designs.

The Thin-PAK 8x8 package is features a very low source inductance 2 nH (vs. 6 nH for D²PAK), separate driver source connection (clean gate signal) as well as a similar thermal performance as D²PAK. The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behaviour and EMI.