AIMCQ120R020M1T Automotive CoolSiC™ MOSFET 1200 V in Q-DPAK (HDSOP-22-3), 19 mΩ

Overview

The CoolSiC™ Automotive MOSFET 1200 V in Q-DPAK package is tailored to address OBC/DC-DC applications for 800V Automotive architecture. Leveraging Top-Side-Cooling (TSC) technology, it can provide customers with an outstanding thermal performance, easier assembly and reduced system cost. Compared to back-side cooling, TSC provides an optimized PCB assembly, thus eliminating parasitic effects and providing much lower stray inductances. 

Summary of Features

  • 0V turn-off
  • Creepage  4.8mm
  • Symmetrical lead layout
  • .XT technology

Benefits

  • Lower package parasitics
  • Lower switching losses
  • Simplified design
  • Optimized PCB assembly

Potential Applications

  • OBC
  • DC-DC converter
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