Infineon introduces sTOLL as its latest high power leadless package in 7x8 mm² with OptiMOS-5™ 40 V and OptiMOS-6™ 40 V for future automotive applications (JEDEC name is MO-319 and IEC name is HSOF-5).

sTOLL offers high current capability of 250 A, more than standard D²PAK (180A), at a footprint of 56 mm² which is even smaller than DPAK (65 mm²). In combination with Infineon’s leading OptiMOS-5™ 40 V and OptiMOS-6™ 40 V power MOS technology, sTOLL offers best in class power density and power efficiency at Infineon’s well known quality level for robust automotive packages.

With sTOLL 7x8 mm² as new package family Infineon challenges the traditional SMD packages like D²PAK (TO263) and DPAK (TO252) providing higher current capability in smaller form factor of 7x8 mm² without sacrificing thermal performance. Further sTOLL as leadless package minimizes stray inductances, package resistance and improves switching behavior over traditional packages DPAK/D²PAK significantly.

Infineon first sTOLL package family will be with OptiMOS-5™ 40 V and OptiMOS-6™ 40 V technology for all future 12 V high current automotive applications, especially EPS, DC/DC and BLDC in CO2 friendly vehicles. In a second step sTOLL package will be extended to higher voltage classes like 80 V and 100 V.

Dimensions:
Body Length: 6.7mm
Body Width: 7mm
Min. Terminal Pitch: 1.3mm 

Click here for a detailed information on the sToll Package PG-HSOF-5-1.