IM70D122 Digital high sensitivity XENSIV™ MEMS microphone enabling high quality audio capturing for laptop & tablet applications
Overview
High performance digital XENSIVTM MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70 dB(A) and a very high sensitivity of -26 dBFS. Especially thanks to its high sensitivity and high SNR the IM70D122 is perfectly tailored for advanced audio capturing which can uplift the audio experience for laptops, tablets, cameras and conference systems. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level.
Summary of Features
- Very high 70dB(A) Signal-to-noise ratio
- Very high sensitivity (-26 dBFS)
- Selectable power modes for battery critical applications (980/260µA)
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- Acoustic overload point (AOP) of 122dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a low LFRO (low frequency roll-off) of 30Hz
Benefits
- Far-field and low volume audio pick-up
- Crystal clear audio signals even at high sound pressure levels
- Enablement of advanced audio features (audio zoom, beamforming)
Potential Applications
- Laptop and tablet
- Conference system
- Camera
- Smart speaker
- Home automation and IoT devices

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