CY8C201xx
The CAPSENSE™ Express family, supported by PSoC™ Designer Visual Embedded System Design Tool and the CAPSENSE™ Express Configuration Tool, helps you get touch sensing functionality fast.
The CAPSENSE™ Express family supports up to ten general purpose I/Os for buttons, multi-segment sliders, LEDs, and other general purpose functions, all configured via I2C registers.
- 2.4 V to 5.5 V core voltage
- Easy to design-in - Configuration through registers
- Up to 10 GPIOs: Combination of Buttons, Multi-segment Slider, LEDs, Other GPIO functions
- I/O Configuration over I2C Interface
- No programming required
- Real-Time Monitoring and Tuning
- Patented CSA technology for robust immunity to conducted and radiated noise
- CAPSENSE™ Express Family CY8C201xx
- Watch our CAPSENSE™ Express demo videos
- Download the "Getting started with CAPSENSE™" Design Guide
- Purchase the CY3280-MBR Evaluation Kit
ログインして全ての文書を見る
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CY3218-CAPEXP1_Kit Guide
EN
01_00 | 2020-07-07 | pdf | 5.3 MB
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CY3218-CAPEXP1_Release_Notes
EN
01_00 | 2020-07-07 | pdf | 74 KB
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CY3218-CAPEXP2 CapSense Express Kit (Up to 10 I/O for Sliders)_Datasheet
EN
01_00 | 2020-07-07 | pdf | 337 KB
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CY3218_CAPEXP2_Kit Guide
EN
01_00 | 2020-07-07 | pdf | 4.8 MB
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CY3218_CAPEXP2_Release_Notes
EN
01_00 | 2020-07-07 | pdf | 74 KB
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CY8CMBR2044 Four Button CapSense Controller Datasheet
EN
CN
11_00 | 2020-10-08 | pdf | 617 KB
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AN64846 Getting Started with CapSense _Japanese
JA
EN
CN
11_00 | 2025-03-14 | pdf | 5.2 MB
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AN85951 PSOC 4 and PSOC 6 MCU CAPSENSE Design Guide _Japanese
JA
09_00 | 2024-10-07 | pdf | 8.9 MB
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AN42137 Capsense Express Software Tool
EN
07_00 | 2020-05-28 | pdf | 668 KB
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AN42137_0B_V(ZH)
CN
07_00 | 2020-05-28 | pdf | 978 KB
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AN44207 CapSense Express APIs for Register Configuration
EN
06_00 | 2020-05-28 | pdf | 523 KB
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AN44207 CapSense Express APIs for Register Configuration
EN
06_00 | 2020-05-28 | zip | 1.2 MB
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AN44208 CapSense Express I2C Communication Timing Analysis
EN
07_00 | 2020-05-28 | pdf | 467 KB
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AN44209 CapSense Express Power and Sleep Considerations
EN
CN
08_00 | 2020-05-28 | pdf | 1.1 MB
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AN48303 CapSense Express Migrating from Firmware Rev 0x15 to Rev 0x1B
EN
06_00 | 2020-05-28 | pdf | 425 KB
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AN48430 CapSense Express Noise Filtering Methods
EN
05_00 | 2020-05-28 | pdf | 289 KB
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AN48755 Designing with CapSense Express 8-pin SOIC Device
EN
05_00 | 2020-05-28 | pdf | 534 KB
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AN53490 CapSense Express Design to Production
EN
06_00 | 2020-05-28 | pdf | 865 KB
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AN54657 CapSense Express 1CS/2CS Button Software Tool Usage
EN
07_00 | 2020-05-28 | pdf | 733 KB
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AN56691 CapSense Express - Creating Reference Designs with 1CS/2CS Button Devices
EN
06_00 | 2020-05-28 | zip | 396 KB
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AN56691 CapSense Express Creating Reference Designs with 1CS/2CS Button Devices
EN
06_00 | 2020-05-28 | pdf | 489 KB
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CY8C201xx Register Reference Guide
EN
08_00 | 2020-06-26 | pdf | 870 KB
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QTP 103209: CAPSENSE EXPRESS DEVICE FAMILY S8DI-5R Fab 4 CMI
EN
06_00 | 2021-11-12 | pdf | 121 KB
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QTP 103210: Capsense Express Device Family - S8DIN-5R Fab 5 GSMC
EN
05_00 | 2021-11-11 | pdf | 92 KB
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QTP 073803: PSOC (8C20100) IN S4AD-5 TECHNOLOGY AT FAB-4 CMI
EN
03_00 | 2021-11-02 | pdf | 97 KB
下記がTop6 FAQ です。その他のFAQについては、上の検索バーをご利用ください。
Resources Available for CAPSENSE™ Controllers
A comprehensive list of resources that you can use to design applications using CAPSENSE™ controllers can be found here.
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How to address multiple CAPSENSE™ Express devices on the same I2C bus?
By default the I2C address of CAPSENSE™ Express capacitive controllers are all set to 0x00h. If the customer board needs to have two CAPSENSE™ Express parts, then the master should follow the below steps to avoid data corruption in the I2C bus:
Step#1: Master puts CE#1 in reset mode by pulling XRES pin high
Step#2: Master sends CE#2 configuration file (generated by PSoC™ Designer) over the I2C bus. Customer should select a different address for CE#1 & CE#2 in PSoC™ Designer to avoid address conflict.
Step#3: Master resets CE#2 (software reset or hardware reset)
Step#4: Master puts CE#2 in reset mode by pulling XRES pin high, this step is optional since after Step#3 CE#2 address will get updated from 0x00h to the user-configured value.
Step#5: Master sends CE#1 configuration file (generated by PSoC™ Designer) over the I2C bus.
Step#5: Master resets CE#1 (software reset or hardware reset).
Note:
i) CE#1 - refers to 'CAPSENSE™ Express' device #1
ii) CE#2 - refers to 'CAPSENSE™ Express' device #2
iii) For the above procedure to work, make sure that at least one of the CAPSENSE™ Express parts (out of the two) on board have the XRES pin bonded out.
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How to get Technical Support?
The best way to reach out to our Applications Engineers is through our Infineon Developer Community
Our Applications Engineers moderate the community to ensure all questions are answered quickly and accurately, either by others in the community or by our own engineers.
If you have any further questions, please submit your request via the Infineon myCases portal. This is a direct channel to get fast and easy support for your needs.
To register, Click on "Register for myInfineon” available at the top right corner of the Infineon homepage and follow the instructions.
To take advantage of additional benefits we recommend to register your corporate email address.
To log-in, click on “Login to myInfineon”.
By clicking on the My Cases link, you will be guided to the My Cases Customer Portal.
You can visit the link directly through: https://mycases.infineon.com.
If any questions, please contact our hotline, https://www.infineon.com/call.
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How to find a Partner to support on SW, HW, dev tools and services?
Infineon’s global network of partners offer products and services that complement our semiconductor device solutions to accelerate your development efforts and time to market. You can find them here: https://www.infineon.com/partnerfinder.
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Where to find the Package information?
The package information is available on our homepage. Please note, that they are divided into the subcategories “Leaded and through-hole”, “Surface Mounted Devices” and “Special Packages”. You will find all relevant package information at the option that applies.
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Where to find board assembly information of Infineon packages?
Information regarding reflow profile, soldering temperature, soldering profile and further processing notes for most of the discrete products are mentioned in the Application Note.
Please visit https://www.infineon.com/packages and refer to the document General Recommendations for Assembly of Infineon Packages.
For TO-packages please refer to these recommendations.
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