FS770R08A6P2LB 750 V 770 A 6パック 自動車認定 IGBTモジュール

概要

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS770R08A6P2LB comes with a baseplate with bonded cooling structure.

特長

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvj op = 150°C
  • Short-time extended Operation Temperature Tvj op = 175°C

利点

  • Compact Design
  • Direct Cooled Base Plate
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements
  • Long tabs for current sense

推奨アプリケーション例

  • Automotive Applications
  • Hybrid Electrical Vehicles (H)EV
  • Motor Drives
  • Commercial Agriculture Vehicles
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Quality beyond the standard: Producing quality automotive power modules

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  • Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
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Infineon's 2nd generation HybridPACK™ Drive CoolSiC™

  •  Infineon's HybridPACK™ Drive silicon carbide compact power modules cater to the increasing demand for high range, efficiency, and power in electrified vehicles, enabling longer drive range, compact size, and optimized system cost.
  • The second generation of Infineon's HybridPACK™ Drive, utilizing CoolSiC™ technology, offers a scalable product family with enhanced features and package improvements, providing added value to customers.
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