FS75R12W2T4_B11

概要

EasyPACK™ 2B 1200 V, 75 A sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology. Also available as variation with Soldering connection technology: FS75R12W2T4

Extend the system power with the latest TRENCHSTOP™ IGBT7 technology in FS100R12W2T7_B11

特長

  • Low switching losses
  • Trench IGBT 4
  • VCEsat with positive temperature coefficient
  • Low VCEsat
  • Al2O3 substrate with low thermal resistance
  • Compact design
  • PressFIT contact technology
  • Rugged mounting due to integrated mounting clamps

利点

  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility

Please also find our EiceDRIVER™ HV Gate Driver portfolio. Including EiceDRIVER™ Compact Driver ICs for your easy and reliable design. Especially the 1EDI60I12AF suitable for IGBT module solution. (Evalboard available) 

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