Infineon joins the EMVCo Board of Advisors to advance mission of increasing trust and consumer convenience in the payment space

Munich, Germany – 19 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the EMVCo Board of Advisors to leverage its decades of experience in the space of semiconductor security and connectivity to improve global trust and convenience in card payments. EMVCo, a global technical body, creates and manages EMV specifications and programs that enable seamless and secure card-based payments for businesses and consumers worldwide. The organization is responsible for authentication specifications and security technologies such as EMV® Chip Contact, EMV 3-D Secure (3DS), and more.

“We are delighted that Infineon Technologies has decided to join the EMVCo Board of Advisors,” said Oliver Manahan, Director of Engagement and Operations for EMVCo. “We look forward to their participation in EMVCo’s work, and the opportunity to benefit from their expertise in semiconductor and payment solutions.” Infineon has worked extensively with global technical bodies such as EMVCo to contribute to payment specifications and help combat fraud. It is hoped that this deeper partnership will further support these efforts.

“As the world’s leader in security ICs for the payment industry, Infineon is committed to innovate and develop technologies and solutions for secured and convenient payments in whatever form they take,” said Tolgahan Yildiz, Vice President Trusted Mobile Connectivity & Transactions at Infineon. “We look forward to working closely with other EMVCo Advisors to enhance the levels of payment security confidence in new and innovative payment form factors used for digital cards and wallets, wireless payments, including Wi-Fi, Bluetooth LE, NFC, and UWB, and the new EMV contactless kernel.”

About EMVCo

EMVCo creates and manages EMV Specifications and programmes that enable seamless and secure card-based payments for businesses and consumers worldwide. EMV Specifications support technologies including EMV Chip Contact, EMV Chip Contactless, Mobile, QR Code, Secure Remote Commerce (SRC), 3-D Secure (3DS) and Payment Tokenisation.

As a global technical body, EMVCo is collectively owned by American Express, Discover, JCB, Mastercard, UnionPay and Visa. Hundreds of payments stakeholders, including merchants, banks and technology providers, participate as EMVCo Associates and Subscribers to develop, evolve and enhance flexible EMV Specifications that support innovation and address marketplace needs. All EMV Specifications are available royalty free on the EMVCo website.

Active engagement and collaboration with the payments industry is key to EMVCo’s proven model for creating, evolving and promoting globally adopted specifications that support innovation and address marketplace needs. The EMVCo Associates Programme (EAP) was established in 2010 to facilitate this engagement and enable the broader payments community to play an active role in EMVCo’s strategic and technical direction. Today, close to a hundred organisations participate as EMVCo Associates to contribute their knowledge and expertise to the development of EMV Specifications. More information is available at www.emvco.com.

Note to the editor:

Infineon management and payment experts will attend Money2020, 22-25 October, in Las Vegas, Nevada. To schedule an editorial meeting and discuss current trends in payment, please contact either Agnes Toan or Fabian Schiffer.