Infineon advances automotive and industrial solutions with newly launched CoolSiC™ MOSFET 750 V G1 product family

Munich, Germany – 27 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications. The product family includes both industrial-graded and automotive-graded SiC MOSFETs that are optimized for totem-pole PFC, T-type, LLC/CLLC, dual active bridge (DAB), HERIC, buck/boost, and phase-shifted full bridge (PSFB) topologies. The MOSFETs are ideal for use in both typical industrial applications, such as electric vehicle charging, industrial drives, solar and energy storage systems, solid state circuit breaker, UPS systems, servers/ datacenters, telecom, and in the automotive sector, such as onboard chargers (OBC), DC-DC converters, and many more.

The CoolSiC MOSFET 750 V G1 technology features excellent RDS _(on) x Q _fr and superior  RDS _(on) x Q _oss Figure-of-Merits (FOMs), resulting in ultra-high efficiency in hard-switching and soft-switching topologies respectively. Its unique combination of high threshold voltage (V _GS(th), Typ. of 4.3 V) with low Q _GD/Q _GS ratio ensures high robustness against parasitic turn-on and enables unipolar gate driving, leading to increased power density and low cost of the systems. All devices use Infineon’s proprietary die-attach technology which delivers outstanding thermal impedance for equivalent die sizes. The highly reliable gate oxide design combined with Infineon’s qualification standards delivers robust and long-term performance.

With a granular portfolio ranging from 8 to 140 mΩ RDS _(on) at 25°C, this new CoolSiC MOSFET 750 V G1 product family meets a wide range of needs. Its design ensures lower conduction and switching losses, boosting overall system efficiency. Its innovative packages minimize thermal resistance, facilitate improved heat dissipation, and optimize in-circuit power loop inductance, thereby resulting in high power density and reduced system costs. It’s important to note that this product family features the cutting-edge QDPAK top-side cooled package.

Availability

The CoolSiC MOSFET 750 V G1 for automotive applications comes in QDPAK TSC, D2PAK-7L, and TO-247-4 packages, while for industrial applications, QDPAK TSC and TO-247-4 packages are offered. More information is available at www.infineon.com/coolsic-mosfet-discretes and in a Webinar Series to learn more about the benefits of CoolSiC MOSFET 750 V G1 in onboard charging applications.

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

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